| Processor |
2x IBM POWER9 “Sforza” Socket (LGA 2601)
4 - 24 core IBM POWER9 Processors
High speed XBUS interconnect |
| Core Logic |
Direct Attach PCIe |
| Form Factor |
EATX, 12” x 13” |
| System Features |
Fan Control |
Y |
| Nominal Fan Zones |
3 |
| Fan Connectors |
7 |
| Fan Control Driver |
MAX31785 / AST2500 |
| Rack Ready |
Y |
| Front Panel Header |
SuperMicro Compatible |
| TPM Header |
LPC / I2C |
| SMBus Header |
Y |
| BMC |
Y |
| BMC Type |
OpenBMC Compatible (AST2500) |
| FlexVer™ Ready |
Y |
| Memory |
Total Slots |
8 (4 channels per CPU) |
| Capacity |
1TB maximum |
| Memory Type |
DDR4 1600/1866/2133/2400/2666 |
| Module Sizes |
8GB, 16GB, 32GB, 64GB, 128GB (RDIMM) |
| Memory Features |
ECC |
| Expansion Slots |
Total PCIe Slots |
2 |
| Total µPCIe Ports |
0 |
| PCIe Generation |
1，2,3,4 |
| CAPI 2 Capable Slots |
1 x16 slo |
| Storage |
Microsemi PM8068
(optional) |
4 SAS (iPASS+)
4 SAS/SATA |
| Networking |
Broadcom BCM5719 |
2 host GbE
NCSI-SI BMC link |
| Graphics |
AST2500 |
VGA |
| USB |
TI TUSB7430 |
2x USB3.0 ports on rear panel
2x USB3.0 ports on internal header |
| Serial |
Host |
1x RS232 port on rear panel |
| BMC |
1x RS232 port on internal header |
| 1x TTL port on internal header |
| Environmental Requirements |
Operation: 10°C - 35°C |
| Storage: -40°C - 70°C |
| Humidity: 20% - 90%, non-condensing |
